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1

Combined loading and failure analysis of lead-free solder joints due to creep and fatigue phenomena

Agata Skwarek, Dr, Jankowski, Krystian, Wymyslowski, Artur, Chicot, Didier

Journal:

Soldering & Surface Mount Technology

Year:

2014

Language:

english

File:

PDF, 277 KB

english, 2014

2

Numerical approach to characterization of thermally conductive adhesives

Tomasz Fałat, Artur Wymysłowski, Jana Kolbe

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 989 KB

english, 2007

3

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski, Bart Vandevelde, Dag Andersson

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 79 KB

english, 2007

4

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 63 KB

english, 2007

5

An approach of numerical multi-objective optimization in stacked packaging

Łukasz Dowhań, Artur Wymysłowski, Rainer Dudek

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 1.16 MB

english, 2008

6

Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 99 KB

english, 2009

7

Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 102 KB

english, 2010

8

Extraction of elastic–plastic material properties of thin films through nanoindentaion technique with support of numerical methods

Łukasz Dowhań, Artur Wymysłowski, Paweł Janus, Magdalena Ekwińska, Olaf Wittler

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 2.06 MB

english, 2011

9

2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 118 KB

english, 2011

10

Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 111 KB

english, 2008

11

Numerical prototyping methods in microsystem accelerometers design

Łukasz Dowhań, Artur Wymysłowski, Stanisław Kaliciński, Paweł Janus

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 2.15 MB

english, 2011

12

Multi-objective decision support system in numerical reliability optimization of modern electronic packaging

Łukasz Dowhań, Artur Wymysłowski, Rainer Dudek

Journal:

Microsystem Technologies

Year:

2009

Language:

english

File:

PDF, 612 KB

english, 2009

13

Advanced numerical prototyping methods in modern engineering applications – Optimisation for micro-electronic package reliability

A. Wymysłowski, W.D. van Driel, J. van de Peer, N. Tzannetakis, G.Q. Zhang

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.14 MB

english, 2007

14

Influence of matrix viscoelastic properties on thermal conductivity of TCA – Numerical approach

Tomasz Falat, Artur Wymysłowski, Jana Kolbe, Kaspar M.B. Jansen, Leo Ernst

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.16 MB

english, 2007

15

2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 118 KB

english, 2012

16

A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging

E.R. Weltevreden, S.J. Tesarski, A. Wymyslowski, M. Erinc, A.W.J. Gielen

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.48 MB

english, 2012

17

Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials

Wymysłowski, Artur, Dowhań, Łukasz

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.49 MB

english, 2013

18

Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

Chicot, D., Tilkin, K., Jankowski, K., Wymysłowski, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 736 KB

english, 2013

19

Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Wymysłowski, Artur

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 190 KB

english, 2014

20

Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Wymysłowski, Artur

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 154 KB

english, 2013

21

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test

Dowhan, Lukasz, Wymyslowski, Artur, Wittler, Olaf, Mrossko, Raul

Year:

2010

Language:

english

File:

PDF, 7.68 MB

english, 2010

22

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Creep and fatigue as main degradation phenomena in reliability of solder joints

Jankowski, K., Wymyslowski, A.

Year:

2014

Language:

english

File:

PDF, 1.76 MB

english, 2014

23

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Investigation of thin films by nanoindentation with doe and numerical methods

Dowhan, Lukasz, Wymyslowski, Artur, Wittler, Olaf

Year:

2011

Language:

english

File:

PDF, 2.59 MB

english, 2011

24

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Numerical Modeling of Electrical Resistance of Interconnections in High-Tech Multilayer PCBs Manufactured by Magnetron Sputtering Deposition of Copper

Borecki, Janusz, Wymyslowski, Artur

Year:

2007

Language:

english

File:

PDF, 5.38 MB

english, 2007

25

A Procedure for Validating the Finite Element Model of a Piezoresistive Ceramic Pressure Sensor

Zarnik, M.S., Belavic, D., Friedel, K.P., Wymyslowski, A.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2004

Language:

english

File:

PDF, 1.37 MB

english, 2004

26

Molecular Modeling and Multiscaling Issues for Electronic Material Applications || Using Coarse-Grained Molecular Models (Molecular-Mesoscale) of a Copper Oxide-Epoxy Interface to Obtain Stress–Strain Failure Predictions Which Include Interfacial Roughness, Water and Filler Effects

Wymyslowski, Artur, Iwamoto, Nancy, Yuen, Matthew, Fan, Haibo

Year:

2015

Language:

english

File:

PDF, 3.33 MB

english, 2015

27

Adhesion work analysis through molecular modeling and wetting angle measurement

Król, Dawid Jan, Wymysłowski, Artur, Allaf, Kamil Nouri

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.11 MB

english, 2015

28

Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Wymysłowski, Artur

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 191 KB

english, 2015

29

Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Wymysłowski, Artur

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 155 KB

english, 2017

30

[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Life prediction of lead alloy based on multi-failure criteria

Jankowski, Krystian, Wymyslowski, Artur

Year:

2017

Language:

english

File:

PDF, 13.78 MB

english, 2017

31

Ion sputtering of microparticles in SIMS depth profile analysis

Piotr Konarski, Iwonna Iwanejko, Agnieszka Mierzejewska, Artur Wymysłowski

Journal:

Year:

2001

Language:

english

File:

PDF, 195 KB

english, 2001

32

A systematic method for optimizing the electron beam hardening process

KP Friedel, J Felba, I Pobol, A Wymysłowski

Journal:

Year:

1996

Language:

english

File:

PDF, 720 KB

english, 1996

33

The lineshape of inelastic neutron scattering in relaxor ferroelectrics

M. A. Ivanov, M. Kozłowski, T. Piesiewicz, V. A. Stephanovich, A. Weron, A. Wymysłowski

Journal:

Physics of the Solid State

Year:

2005

Language:

english

File:

PDF, 319 KB

english, 2005

34

[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Influence of conversion level on simulation results of crosslinked polymers

Tesarski, Sebastian J., Wymyslowski, Artur, Holck, Ole

Year:

2012

Language:

english

File:

PDF, 2.55 MB

english, 2012

35

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Numerical simulation and optimisation of the vacuum microsensor

Wymyslowski, A., Urbanski, K.J., Berlicki, T.M.

Year:

2005

Language:

english

File:

PDF, 1.41 MB

english, 2005

36

[IEEE 2008 IEEE Interdisciplinary Conf on Portable Info Devices (PORTABLE) - Polytronic 2008 IEEE Conf on Polymers and Adhesives in Microelectronics and Photonics - Garmisch-Partenkirchen, Germany (2008.08.17-2008.08.20)] PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - The polymer materials as the essential input parameters in numerical multi-objective optimization of stacked packaging

Dowhan, Lukasz, Wymyslowski, Artur, Felba, Jan, Dudek, Rainer

Year:

2008

Language:

english

File:

PDF, 786 KB

english, 2008

37

[IEEE 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE) - Dresden, Germany (2014.5.7-2014.5.11)] Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Acceleration of life prediction of solder joints using multi-failure criteria

Jankowski, Krystian, Wymyslowski, Artur

Year:

2014

Language:

english

File:

PDF, 411 KB

english, 2014

38

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Parametric Approach to Numerical Design for Optimization of Stacked Packages

Dowhan, Lukasz, Wymyslowski, Artur, Dudek, Rainer, Auersperg, Jurgen

Year:

2006

Language:

english

File:

PDF, 8.78 MB

english, 2006

39

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique

Dowhan, Lukasz, Wymyslowski, Artur, Janus, Pawel, Ekwinska, Magdalena, Wittler, Olaf

Year:

2010

Language:

english

File:

PDF, 2.30 MB

english, 2010

40

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Application of molecular modelling for analysis of a surface energy and its comparison with the experimental results based on wetting angle measurement

Krol, D., Wymyslowski, A., Zubel, I., Rola, K.

Year:

2013

Language:

english

File:

PDF, 682 KB

english, 2013

41

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Simulated annealing as a global optimization algorithm used in numerical prototyping of electronic packaging

Dowhan, Lukasz, Wymyslowski, Artur, Urbanski, Krzysztof

Year:

2009

Language:

english

File:

PDF, 2.37 MB

english, 2009

42

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique

Wymyslowski, Artur, Wittler, O., Mrossko, R., Dudek, Rainer, Auersperg, Juergen, Dowhan, Lukasz

Year:

2009

Language:

english

File:

PDF, 688 KB

english, 2009

43

[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Advanced numerical prototyping methods in modern engineering applications

van Driel, W.D., van de Peer, J., Tzannetakis, N., Wymyslowski, A., Zhang, G.Q.

Year:

2004

Language:

english

File:

PDF, 877 KB

english, 2004

44

[IEEE 2010 33rd International Spring Seminar on Electronics Technology (ISSE) - Warsaw, Poland (2010.05.12-2010.05.16)] 33rd International Spring Seminar on Electronics Technology, ISSE 2010 - Influence of meso–scale analysis parameters of cross–linked polymers on final simulation results

Tesarski, Sebastian J., Holck, Ole, Platek, Bartosz T., Wymyslowski, Artur

Year:

2010

Language:

english

File:

PDF, 486 KB

english, 2010

45

[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Sequential approach to numerical optimization of the LTCC ceramic pressure sensor

Wymyslowski, A., Santo-Zamik, M., Belavic, D.

Year:

2005

Language:

english

File:

PDF, 1.43 MB

english, 2005

46

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Numerical approach to multiscale evaluation and analysis of Tg of crosslinked polymers

Tesarski, Sebastian J., Holck, Ole, Wymyslowski, Artur

Year:

2010

Language:

english

File:

PDF, 10.53 MB

english, 2010

47

[IEEE Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems - EuroSimE 2004 - Brussels, Belgium (10-12 May 2004)] 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the - Numerical simulation and experimental verification of the thermal contact properties of the polymers bonds

Wymyslowski, A., Falat, T., Friedel, K., Felba, J.

Year:

2004

Language:

english

File:

PDF, 739 KB

english, 2004

48

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results

Tesarski, Sebastian J., Wymyslowski, Artur, Holck, Ole

Year:

2011

Language:

english

File:

PDF, 2.08 MB

english, 2011

49

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique

Jankowski, K., Swierczynski, R., Urbanski, K., Wymyslowski, A., Chicot, D., Dudek, R.

Year:

2013

Language:

english

File:

PDF, 973 KB

english, 2013

50

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging

Weltevreden, E.R., Erinc, M., Tesarski, S.J., Wymyslowski, A., Mavinkurve, A., Giele, A.W.J.

Year:

2011

Language:

english

File:

PDF, 1.75 MB

english, 2011

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